Semiconductor module



FIG. 1 is a front, top, right side perspective view of a semiconductor module showing my new design;

FIG. 2 is a rear, bottom, left side perspective view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side elevation view thereof;

FIG. 8 is a left side elevation view thereof; and,

FIG. 9 is a cross sectional front elevation view thereof, taken in the direction of line 9-9 in FIG. 5.

In FIGS. 2 and 6, the oblique line shading shown on the bottom side indicates a translucent surface. 

CLAIM The ornamental design for a semiconductor module, as shown and described. 